House bill would bar CHIPS Act-funded fabs from buying Chinese-made chip tools

US lawmakers have introduced bipartisan legislation to tighten restrictions on companies receiving federal semiconductor subsidies, aiming to block to use of equipment made by entities linked to foreign adversaries, such as China.

The so-called “Chip EQUIP Act of 2025” was introduced by representatives Zoe Lofgren and Jay Obernolte, with a Senate companion to be introduced in early December by Senators Mark Kelly and Marsha Blackburn.

“The Chip EQUIP Act ensures that the tools used in our fabrication facilities meet the highest standards of reliability and integrity,” Obernolte said; Lofgren framed the bill as preventing CHIPS funds from supporting adversaries’ equipment capacity.

If enacted, CHIPS recipients (Intel, TSMC, Samsung and others) would face procurement restrictions on fab tools used in their U.S. facilities, tightening compliance alongside Commerce export controls. Primary bill text and one-pager are posted by the committee.